| Thin Film Processes |
| PVD ("Physical Vapor Deposition", metallic or reactive): - Magnetron sputtering - Evaporation (resistive, E-beam) - Cathodic Arc (random, steered, filtered) - Plasma-assisted PVD - Ion-assisted PVD |
| CVD ("Chemical Vapor Deposition") - Thermal CVD - Plasma-enhanced CVD (Microwave, RF) |
| Hybrid processes (e.g. Arc / Sputtering) |
| Process integration (e.g. multi-layers, multi-process) |
| Thick Film Processes |
| Spin-On |
| Screen Printing |
| Process Management & Support |
| Work Cell Lay-out |
| Source Design |
| Tooling Design |
| Technology evaluation |
| Production Cost Analysis |
| Process development |
| Process Control Techniques / Monitoring |
| Equipment qualification |
| Yield Improvements |
| Efficiency improvements |
| Operator training |
| Documentation |
| IP Investigation |
| © Chris H. Stoessel, 2003 - 2020 |
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